Rapidus has completed an additional funding round of $943 million from the Information-Technology Promotion Agency (IPA), Japan, an independent administrative agency under the jurisdiction of the Ministry of Economy, Trade ...
The post Rapidus IPA funding reaches $2.65bn appeared first on Electronics Weekly.
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Rapidus IPA funding reaches $2.65bn
-
Pairing SiC MOSFETS and gate drivers
onsemi has announced its Elite Pairing Studio – an online design tool that pairs SiC MOSFETs and gate drivers for power electronics applications, including AI datacentres, EVs, and industrial systems. ...
The post Pairing SiC MOSFETS and gate drivers appeared first on Electronics Weekly. -
AMD investing £2bn in UK
AtvLondon Tech Week this morning, AMD Chair and CEO Dr. Lisa Su (pictured) outlined a series of investments worth £2 billion designed to accelerate the UK’s AI ecosystem and support ...
The post AMD investing £2bn in UK appeared first on Electronics Weekly. -
Nidec debuts highest capacity in-rack cooling prototype
At Interop Tokyo 2026, Nidec will introduce a prototype in-rack CDU (coolant distribution unit) with a cooling capacity of up to 300kW. The CDU is designed to manage the thermal ...
The post Nidec debuts highest capacity in-rack cooling prototype appeared first on Electronics Weekly. -
PM applauds British brains
The Prime Minister’s speech to London Tech Week this morning showed an appreciation of British brain power. Sir Keir said that the UK gets half of all the tech startup ...
The post PM applauds British brains appeared first on Electronics Weekly. -
Embedded World Video: AMD on what’s changing for AI and industrial robotics
We recently caught up with AMD’s Senior Director of Embedded Product Marketing, Amey Deosthali, as part of our promotional coverage for Embedded World 2026. He talks about how AI is ...
The post Embedded World Video: AMD on what’s changing for AI and industrial robotics appeared first on Electronics Weekly. -
Embedded World Video: AMD on FPGA Innovation and AI at the Edge
We recently caught up with AMD’s Director of FPGA Solutions, Manuel Uhm, as part of our promotional coverage for Embedded World 2026. He discusses how FPGAs are enabling efficient AI ...
The post Embedded World Video: AMD on FPGA Innovation and AI at the Edge appeared first on Electronics Weekly. -
Rinse and Repeat for Intel 14A
Intel’s five-nodes-in-four years process technology catch-up was an attempt to go too far too fast said CFO David Zinsner at at the Bank of America 2026 Global Technology Conference in ...
The post Rinse and Repeat for Intel 14A appeared first on Electronics Weekly. -
Semiconductor sales up 93.9% y-o-y in April, says SIA
April semiconductor sales of $110.5bn were 11% up on the $99.5bn of March 2026 and 93.9% more than the April 2025 total of $56.9bn, according to the SIA. The SIA ...
The post Semiconductor sales up 93.9% y-o-y in April, says SIA appeared first on Electronics Weekly. -
April semiconductor sales up 93.9% YoY says SIA
April semiconductor sales of $110.5 billion were 11% up on the $99.5 billion of March 2026 and 93.9% more than the April 2025 total of $56.9 billion, according to the ...
The post April semiconductor sales up 93.9% YoY says SIA appeared first on Electronics Weekly. -
Jittery SOX
The SOX fell 12% last Thursday and Friday to 12,217. It was just shy of 14000 on June 3rd. Friday’s 10% fall was the steepest since March 2020. The culprit ...
The post Jittery SOX appeared first on Electronics Weekly. -
Nvidia tools for TSMC processes
TSMC has revealed it is using NVIDIA CUDA-X libraries and AI models for a number of tasks based on Nvidia GPUs used to optimise TSMC fab processes: Computational lithography: TSMC ...
The post Nvidia tools for TSMC processes appeared first on Electronics Weekly. -
Business Finland backs Iceye with further €28.3 million grant
Iceye, the Finnish specialist in satellite-based SAR imagery (Synthetic Aperture Radar), has received a €28.3 million continuation grant from Business Finland. This is Finland’s public innovation agency, and it’s the ...
The post Business Finland backs Iceye with further €28.3 million grant appeared first on Electronics Weekly. -
Vishay 3000 W transient voltage suppressors in DFN6546A package
Vishay Intertechnology has announced four series of unidirectional and bidirectional 3000 W PAR and TRANSZORB surface-mount transient voltage suppressors (TVS). They are designed to protect electronics against voltage transients induced ...
The post Vishay 3000 W transient voltage suppressors in DFN6546A package appeared first on Electronics Weekly. -
C C Wei wishes Elon “Good Luck” with TeraFab
TSMC CEO C C Wei (pictured) has wished Elon Musk ‘Good Luck’ in his pursuit of a 1m wpm TeraFab, adding: “It will take quite long.” Speaking at the TSMC ...
The post C C Wei wishes Elon “Good Luck” with TeraFab appeared first on Electronics Weekly. -
SK Hynix to double output in five years
SK Hynix is to double its production capacity over the next five years, says chairman Chey Tae-won. The company has budgeted $67 billion between 2024 and 2028 to fund expansion. ...
The post SK Hynix to double output in five years appeared first on Electronics Weekly. -
Quantinuum gets $16bn market cap in IPO
Quantinuum, the joint Honeywell-Cambridge Quantum startup, has raised $1.68 billion on the Nasdaq. By the market close, Quantinuum’s market cap was $15.7 billion. The company was formed in 2021 to ...
The post Quantinuum gets $16bn market cap in IPO appeared first on Electronics Weekly. -
Farnell’s Drones Club
Farnell has brought out a drone support offering for engineers and innovators developing unmanned aerial systems across a wide range of industries. As demand for drones continues to grow across ...
The post Farnell’s Drones Club appeared first on Electronics Weekly. -
Cambridge Tech Week Speakers List
‘How Deep Tech Changes the World’, is the discussion theme of this year’s Cambridge Tech Week rnning from September 14-18. The festival will focus on how to move frontier technologies ...
The post Cambridge Tech Week Speakers List appeared first on Electronics Weekly. -
Jedec SiC Guidelines improve reliability in WBG power electronics
JEDEC is publishing two new guidelines around the use of wide bandgap (WBG) power semiconductor materials, such as Gallium Nitride (GaN) and Silicon Carbide (SiC). There is JEP203: Guideline for ...
The post Jedec SiC Guidelines improve reliability in WBG power electronics appeared first on Electronics Weekly. -
Overcoming durability and cost barriers for wearables and foldable devices
The rapid evolution of wearable and foldable technology is reshaping consumer electronics, writes Samudrapom Dam. As market demand grows, wearable and foldable electronic devices face critical challenges in durability and ...
The post Overcoming durability and cost barriers for wearables and foldable devices appeared first on Electronics Weekly. -
Tiny SoM featuring NXP’s i.MX 91 targets Linux-based IoT
Direct Insight is introducing its QS91 system-on-module featuring NXP’s i.MX 91 applications processor. The Oxfordshire-based integrator says the SoM delivers an “optimised blend of security, features, and energy-efficient performance” for ...
The post Tiny SoM featuring NXP’s i.MX 91 targets Linux-based IoT appeared first on Electronics Weekly. -
Tessalia plans $250m packaging plant in France
Earlier this week Tessalia Technology. a packaging jv between Foxconn, Radiall, and Thales, laid the foundation stone of an advanced semiconductor packaging facility in Le Barp, Nouvelle-Aquitaine. Patrice Caine, Chairman ...
The post Tessalia plans $250m packaging plant in France appeared first on Electronics Weekly. -
Nissan to make cars for Chery at Sunderland
Nissan and Chinese car maker Chery have signed a non-binding MoU for the study of contract manufacturing for Nissan to manufacture Chery UK passenger vehicles at its Sunderland Plant. Under ...
The post Nissan to make cars for Chery at Sunderland appeared first on Electronics Weekly. -
Chips Act II proposed – much like Chips Act 1
The EU has proposed a Chips Act II which will give the Commission power to invest directly in new EU-based fabs instead of requiring companies to apply for subsidies. The ...
The post Chips Act II proposed – much like Chips Act 1 appeared first on Electronics Weekly. -
N-channel and P-channel MOSFETs in a single package
Toshiba has launched a 30V dual MOSFET that integrates both N-channel and P-channel MOSFETs in a single package. The product is suitable for applications including single-phase brushless DC (BLDC) motor ...
The post N-channel and P-channel MOSFETs in a single package appeared first on Electronics Weekly. -
N-channel and P-channel MOSFETs in a single package.
Toshiba has launched a 30V dual MOSFET that integrates both N-channel and P-channel MOSFETs in a single package. The product is suitable for applications including single-phase brushless DC (BLDC) motor ...
The post N-channel and P-channel MOSFETs in a single package. appeared first on Electronics Weekly. -
Ten four-hole flange jack connector optimised for use with 1.37mm cable
Amphenol RF has introduced its first NEX10 four-hole flange jack connector optimised for use with 1.37mm cable in compact RF system designs. This four-hole flange jack connector is designed to ...
The post Ten four-hole flange jack connector optimised for use with 1.37mm cable appeared first on Electronics Weekly. -
10 4-hole flange jack connector optimised for use with 1.37mm cable
Amphenol RF hascintroduced its first NEX10 4-hole flange jack connector optimised for use with 1.37 mm cable in compact RF system designs. This 4-hole flange jack connector is designed to ...
The post 10 4-hole flange jack connector optimised for use with 1.37mm cable appeared first on Electronics Weekly. -
Littelfuse NANO² SMD 708 fuses for 48 VDC AI datacentres
Littelfuse's NANO² SMD 708 fuses are small, square, surface mount fuses aimed at compact high-power applications.
The post Littelfuse NANO² SMD 708 fuses for 48 VDC AI datacentres appeared first on Electronics Weekly.
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