Rohm is licensing TSMC’s GaN process technology and installing it at its Hamamatsu fab. Rohm has been running a GaN process at Hamamatsu for four years, initially with a 150V ...
The post Rohm licenses TSMC GaN process technology appeared first on Electronics Weekly.
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Rohm licenses TSMC GaN process technology
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Space-Comms Expo: Open Cosmos layers ConnectedCosmos
Open Cosmos has announced its layered satellite architecture, ConnectedCosmos, for resilient Ka-band communications. The dedicated connectivity infrastructure enables a combination of norrowband and broadband services. For example, support for point-to-point ...
The post Space-Comms Expo: Open Cosmos layers ConnectedCosmos appeared first on Electronics Weekly.
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Nvidia invests $4bn in Lumentum and Coherent for optical interconnect
NVIDIA is investing $2 billion each in Lumentum and Coherent to accelerate innovation in advanced optics technologies to enable AI infrastructure and systems designs. In both cases the deals also ...
The post Nvidia invests $4bn in Lumentum and Coherent for optical interconnect appeared first on Electronics Weekly.
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Ayar Labs raises $500m
Ayar Labs, the co-packaged optics (CPO) specialist, has raised $500 million in Series E funding. The company will use the funds to scale high-volume production and test capacity to accelerate ...
The post Ayar Labs raises $500m appeared first on Electronics Weekly.
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Avnet Silica and Thales offer secure eSIM to engineering teams
Avnet Silica and Thales have joined up to deliver an eSIM offering to industry. The offering includes both a standalone eSIM component and an integrated offer combining the eSIM with ...
The post Avnet Silica and Thales offer secure eSIM to engineering teams appeared first on Electronics Weekly.
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Craig Barratt to be Chairman of Intel
Intel has appointed Craig Barratt (pictured) to be its next chairman, taking over from Frank Yeary who became chairman in 2023. Barratt joined the Intel board last gear. He previously ...
The post Craig Barratt to be Chairman of Intel appeared first on Electronics Weekly.
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Micron sampling 256GB LPDRAM module
Micron is sampling a 256GB LPDRAM module — 256GB SOCAMM2 – based on a 32Gb LPDDR5X die. “Micron’s 256GB SOCAMM2 offering enables the most power-efficient CPU-attached memory solution for both ...
The post Micron sampling 256GB LPDRAM module appeared first on Electronics Weekly.
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Wi-Fi HaLow module increase 2.4GHz range x10
At MWC in Barcelona (2-5 March), Quectel Wireless Solutions launched the FGH200M long range, low power module. It is based on the IEEE 802.11ah wireless networking (Wi-Fi HaLow) protocol and ...
The post Wi-Fi HaLow module increase 2.4GHz range x10 appeared first on Electronics Weekly.
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RS buys BPX
RS Group has bought BPX Group, a UK and Ireland-based specialist distributor of industrial automation and control (“A&C”) products, for an Enterprise Value (cash-free debt-free) of £27 million and a ...
The post RS buys BPX appeared first on Electronics Weekly.
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ASML looking at expanding into packaging
ASML is looking at expanding from front-end litho into packaging, according to CTO Marco Pieters (pictured). “”We look at what are potential directions the industry could take, and what would ...
The post ASML looking at expanding into packaging appeared first on Electronics Weekly.
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MWC: Skyworks and Mediatek reference design for front-end PA for 6G
Skyworks and Mediatek have produced a reference design of a 6G FR3 frequency range RF front-end (RFFE) power amplifier. The design of the SKYR60002 advanced 6G FR3 LNA and power ...
The post MWC: Skyworks and Mediatek reference design for front-end PA for 6G appeared first on Electronics Weekly.
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Imec PDKs for packaging sub-2nm chiplets
Imec’s NanoIC pilot line has brought out two PDKs for sub-2nm processes: a fine-pitch redistribution layer (RDL) and die-to-wafer (D2W) hybrid bonding PDK. These early-access PDKs bring advanced packaging capabilities ...
The post Imec PDKs for packaging sub-2nm chiplets appeared first on Electronics Weekly.
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Toray powder delivers smooth, strong 3D printed parts
Toray Industries is sampling Toraypearl polyamide (PA) 12, a truly spherical PA12 powder widely compatible with powder bed fusion (PBF)-type 3D printers. Leveraging Toray’s proprietary polymer particle engineering technology, the ...
The post Toray powder delivers smooth, strong 3D printed parts appeared first on Electronics Weekly.
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Advantages of GaN-on-Si HEMT for 5G mm-wave range
Researchers at Soitec and Nanyang Technological University have reported 60%+ power-added efficiency (PAE), for moderately scaled GaN-on-Si HEMTs at 30GHz operation. The devices also perform with state-of-the-art noise figures down ...
The post Advantages of GaN-on-Si HEMT for 5G mm-wave range appeared first on Electronics Weekly.
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S8AS2 smart power supply integrates power, protection, and diagnostics
Omron’s S8AS2 compact smart power supply combines DC power supply, electronic circuit protection, and real-time monitoring in one panel-mountable unit. Reducing the number of components required in the control cabinet ...
The post S8AS2 smart power supply integrates power, protection, and diagnostics appeared first on Electronics Weekly.
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Jedec updates Universal Flash Storage for faster edge AI
Jedec has officially updated the Universal Flash Storage (UFS) standard with UFS 5.0. It aims to increase storage performance and efficiency for edge device AI applications. The aim is improved ...
The post Jedec updates Universal Flash Storage for faster edge AI appeared first on Electronics Weekly.
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OpenAI completes $110bn funding round
OpenAI has raised $110 billion from Amazon, Nvidia and Softbank. Amazon put in $50 billion and Nvidia and SoftBank put up $30 billion each. The funding round values OpenAI at ...
The post OpenAI completes $110bn funding round appeared first on Electronics Weekly.
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MWC: Ericsson and Intel join for 6G AI-RAN
Ericsson and Intel are collaborating for the transition to AI-native 6G deployments and use cases. The collaboration will span mobile connectivity, cloud technologies, and compute capabilities across AI-driven RAN and ...
The post MWC: Ericsson and Intel join for 6G AI-RAN appeared first on Electronics Weekly.
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MWC: Telecom companies and Nvidia pursue AI-RAN in 6G
Nvidia has hooked up with Booz Allen, BT, Cisco, Deutsche Telekom, Ericsson, MITRE, Nokia, OCUDU Ecosystem Foundation, ODC, SK Telecom, SoftBank and T-Mobile — to build 6G networks on AI-native, ...
The post MWC: Telecom companies and Nvidia pursue AI-RAN in 6G appeared first on Electronics Weekly.
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High margins and low volumes
Semiconductor sales will grow 26% this year to $975 billion, says a report from Deloitte’s. AI chips will be responsible for half the revenues while making up 0.2% of the ...
The post High margins and low volumes appeared first on Electronics Weekly.
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Siemens Digital launches Agentic Toolkit
Siemens Digital has brought out an Agentic Toolkit, which brings agentic AI workflows to its Questa One verification software to accelerate creation, verification planning, execution, debugging and closure. The Toolkit ...
The post Siemens Digital launches Agentic Toolkit appeared first on Electronics Weekly.
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Amphenol RF adds single-crimp N-Type connectors
Amphenol RF has added single-crimp N-Type connectors to its interconnect portfolio. These connectors offer the abilityto attach the connectors to cable with only one crimp of the ferrule, eliminating the ...
The post Amphenol RF adds single-crimp N-Type connectors appeared first on Electronics Weekly.
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Nordic reference design integrates Aliro and Matter
Nordic Semiconductor has brought out a new reference design enabling secure, interoperable access control solutions for commercial and residential applications using Aliro and Matter. The release coincides with the Aliro ...
The post Nordic reference design integrates Aliro and Matter appeared first on Electronics Weekly.
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NATO Innovation Fund leads £30m funding for SatVu thermal intelligence
SatVu, the London-based thermal infrared satellite specialist, has raised £30m ($40m) in its latest funding round, lead by the NATO Innovation Fund. This brings its total equity funding to £60m ...
The post NATO Innovation Fund leads £30m funding for SatVu thermal intelligence appeared first on Electronics Weekly.
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Rohm fits HPLF5060 package for automotive, low-voltage MOSFETs
Rohm is using its new HPLF5060 package (4.9mm × 6.0mm) to expand its lineup of low-voltage (40V/60V) MOSFETs for automotive applications. For example, main inverter control circuits, electric pumps, and ...
The post Rohm fits HPLF5060 package for automotive, low-voltage MOSFETs appeared first on Electronics Weekly.
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Intel Foundry’s Kevin O’Buckley joins Qualcomm
Qualcomm has announced that Kevin O’Buckley will join the company on 2 March as executive vice president of global operations and supply chain. O’Buckley is currently senior vice president and ...
The post Intel Foundry’s Kevin O’Buckley joins Qualcomm appeared first on Electronics Weekly.
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London to be OpenAI’s largest research hub outside US
Yesterday OpenAI said London would be its largest research hub outside the US.. “We are excited to establish London as a major research hub for OpenAI, building on the leading ...
The post London to be OpenAI’s largest research hub outside US appeared first on Electronics Weekly.
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Tensor Robocar hooks up with Arm
The Tensor Robocar, a Level 4 ADAS vehicle being launched this year, is has 433 safety-capable, power-efficient Arm-based cores in each vehicle. The San Jose car company is defining its ...
The post Tensor Robocar hooks up with Arm appeared first on Electronics Weekly.
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Lane Motorsport signs Axon Cable
Lane Motorsport. the specialist division of Lane Electronics, has signed a UK- and Ireland-wide distribution agreement with Axon’ Cable. Axon’ have been manufacturing high performance miniature connectors and complex cable ...
The post Lane Motorsport signs Axon Cable appeared first on Electronics Weekly.
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Semiconductor Intelligence forecasts 30% semi growth this year
The global semiconductor market in 2025 was $792 billion, according to WSTS. 2025 was up 25.6% from 2024, the strongest growth since 26.2% in the COVID recovery year 2021, reports ...
The post Semiconductor Intelligence forecasts 30% semi growth this year appeared first on Electronics Weekly.
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