Electronics news

• ESA signs OHB for next-gen Sentinel-3 topography mission

  10-11-2026 16:18 via Latest Electronics News and Innovations | Electronics Weekly
  The German space systems integrator OHB has been awarded, by the European Space Agency (ESA), a €554 million contract for two next-gen Sentinel-3 topography satellites. The Sentinel-3 Next Generation Topography […]
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• Nickel/aluminium is the smarter alternative to traditional silver/aluminium EMI shielding materials

  10-11-2026 13:00 via Latest Electronics News and Innovations | Electronics Weekly
  Nickel-aluminium (Ni/Al) is emerging as an alternative to silver-aluminium (Ag/Al) in shielding applications, writes Rachid Ait El Cadi. For decades Ag/Al conductive elastomer gaskets have occupied a leading position in electromagnetic […]
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• TSMC October revenues up 59.7% YoY

  10-11-2026 12:46 via Latest Electronics News and Innovations | Electronics Weekly
  TSMC today announced a 59.7% rise YoY and a $14.7% rise  MoM for its October revenue of $17.8 billion. Revenue for January through October 2026 totaled $136.2 billion, an increase […]
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• Infineon expects a €20bn 2027

  10-11-2026 12:08 via Latest Electronics News and Innovations | Electronics Weekly
  Infineon had Q4 FY 2026 revenue  of €4.706 billion for profit of €1.119 billion at a margin of 23.8% For FY 2026 it had revenue of €16.353 billion, up 12up […]
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• Electronica: Sandisk iNAND CL EM181 Embedded Flash Drive for IoT

  10-11-2026 11:47 via Latest Electronics News and Innovations | Electronics Weekly
  Sandisk is introducing the SANDISK iNAND CL EM181 Embedded Flash Drive (EFD) for the physical AI and IoT markets. It officially announced the drive at electronica 2026. Available in 64GB, […]
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• Delays reported at Rapidus

  10-11-2026 08:36 via Latest Electronics News and Innovations | Electronics Weekly
  Rapidus, Japan’s state-backed effort to make 2nm chips, has failed to make a functioning 2nm SRAM reports Bloomberg. The failure puts in question its targets of entering 2nm mass production […]
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• Gallium Oxide wafers in early production

  10-11-2026 07:12 via Latest Electronics News and Innovations | Electronics Weekly
  Gallium oxide (Ga₂O₃) is moving into early production mode. The  ultra-wide bandgap material with a bandgap around 4.7 to 4.9 eV — nearly fifty percent wider than SiC — is […]
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• Ardian Semi raises €1bn

  10-11-2026 07:10 via Latest Electronics News and Innovations | Electronics Weekly
  A private equity company dedicated to making investments in the semiconductor supply chain has raised €1 billion The company,  Ardian Semiconductor, is part of the French private equity company Ardian. […]
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• Infineon first to fab SiC on 300mm wafers

  10-11-2026 07:08 via Latest Electronics News and Innovations | Electronics Weekly
  Infineon is processing 300mm SiC wafers into functional power devices at its fab in Villach, Austria. Infineon used  existing silicon (Si) manufacturing equipment. The larger wafer diameter offers 2.3 times […]
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• Electronica: Weebit Matrix prototypes IMC algorithms

  10-11-2026 07:07 via Latest Electronics News and Innovations | Electronics Weekly
  Weebit Nano, a developer and licensor of advanced technologies, has launched the Weebit Matrix In-Memory Compute (IMC) Research Program, designed to accelerate exploration of next-generation computing architectures. The program provides […]
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• Electronica: Development platform for humanoid robots

  10-11-2026 07:06 via Latest Electronics News and Innovations | Electronics Weekly
  At electronica 2026, Inova Semiconductors is showcasing a development platform for humanoid robots built on Inova’s APXpress high-speed networking technology and low-power Lattice CertusPro and Lattice CrossLink NX FPGAs. DLR’s […]
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