Electronics news

• SOSA-aligned TVPX210 3U OpenVPX carrier board offers modular I/O

  23-09-2026 16:52 via electronicsweekly.com
  Tews Technologies has announced its TVPX210, a 3U OpenVPX carrier board aligning with the SOSA technical standard. It’s for system designers to integrate high-performance modular I/O into next-generation defence and […]
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• RAF Space Squadron forms to defend Britain’s satellites

  23-09-2026 12:13 via electronicsweekly.com
  The UK’s Chief of Air Staff, Air Chief Marshal Sir Harv Smith, has announced the formation of an RAF Space Squadron to defend British satellites and interests in space. Its […]
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• UKSA backs Filtronic to develop RF over IP for digital satellite ground networks

  23-09-2026 11:26 via electronicsweekly.com
  Filtronic, the high-frequency connectivity specialist, has been awarded funding through the UK Space Agency’s Ground Station Innovation Programme (GSIP). It will develop next-gen RF over IP technology to help support […]
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• Sponsored Content: Designing Backup Power for Electronic Door Release After a Vehicle Crash

  23-09-2026 10:30 via electronicsweekly.com
  Electronic door systems improve packaging and user experience, but they also create a clear engineering question: what releases the door if the vehicle low-voltage supply is lost after a severe […]
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• Chip Turf War in China

  23-09-2026 07:16 via electronicsweekly.com
  A Chinese semiconductor industry Turf War is brewing as DRAM specialist CXMT looks to get into NAND – the province of Yangtze Memory (YMTC) – while YMTC is making moves […]
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• Alibaba announces its most powerful AI processor yet

  23-09-2026 07:15 via electronicsweekly.com
  Yesterday, T-Head, Alibaba’s chip unit, previewed its most powerful AI processor yet – the  Zhenwu V900 aimed at both training and inference. Production is scheduled for Q1 2027. The technology […]
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• Cadence agent delivers production‑ready RTL covering PPA

  23-09-2026 07:11 via electronicsweekly.com
   Cadence has introduced a new agent for Cadence ChipStack AI Super Agent that automates front‑end digital design and verification—covering power, performance and area (PPA)-driven spec‑to‑RTL generation, RTL analysis, and refinement; […]
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• Cadence agent delivers production‑ready RTL covering PPA.

  23-09-2026 07:11 via electronicsweekly.com
   Cadence has introduced a new agent for Cadence ChipStack AI Super Agent that automates front‑end digital design and verification—covering power, performance and area (PPA)-driven spec‑to‑RTL generation, RTL analysis, and refinement; […]
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• 59% growth for 2025 DRAM module market

  23-09-2026 07:11 via electronicsweekly.com
  The 2025 DRAM module market grew 59% YoY to $21.2 billion, says TrendForce, a significant acceleration from the 7% growth of 2024. The top five global DRAM module makers accounted […]
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• MCUs for real-time control in power and motor applications

  23-09-2026 07:03 via electronicsweekly.com
  Infineon is sampling  its PSOC Control C3 Performance Line MCU family to enable real-time control for power and motor applications. Based on Arm Cortex-M33 multi-core architecture, PSOC Control C3 Performance […]
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