Electronics news

• Switzerland hits peak deep tech investment levels

  17-06-2026 10:30 via electronicsweekly.com
  Switzerland has taken first place in the countries ranked according to the share of venture capital per capita that is spent on deep tech. The Swiss Deep Tech Report 2026 ...
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• E6 and Orbray establish process for 3-inch diamond wafers

  17-06-2026 07:28 via electronicsweekly.com
  Element Six (E6) of Oxford and Orbray of Tokyo have established a reproducible process for 3-inch wafer-scale single crystal (WSC) diamond, representing a significant step change in size, uniformity and ...
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• Power SiC market growing at 20% CAGR 2025-31 to $11bn

  17-06-2026 07:19 via electronicsweekly.com
  The power SiC market is forecast to be worth $11 billion by 2031 growing at 20% CAGR between 2025 and 2031, fuelled by AI datacentres, 800V EVs, and renewable energy ...
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• FRAM scaled to 22nm

  17-06-2026 07:16 via electronicsweekly.com
  FRAM has been scaled to the 22nm manufacturing node using an innovative 3D capacitor architecture. By vertically integrating ferroelectric capacitors made from hafnium zirconium oxide (HZO) thin films, CEA-Leti researchers ...
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• Innatera hooks up with Cyran for AI-at-the-edge

  17-06-2026 07:11 via electronicsweekly.com
  Innatera, the neuromorphic  processor developer, and Cyran AI, a specialist in intelligent sensing and embedded AI, have expanded their collaboration aimed at accelerating the development of next-generation intelligent edge devices. ...
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• VPI Technology joins Morse Micro Design Partner Program

  17-06-2026 07:09 via electronicsweekly.com
  VPI Technology has joined Morse Micro’s Design Partner Program, bringing its full-stack Wi-Fi HaLow design and manufacturing expertise. The partnership marks a continued expansion of the Wi-Fi HaLow ecosystem, bringing ...
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