• High-speed and on-silicon-chip graphene blackbody emitters

    High-speed light emitters integrated on silicon chips can enable novel architectures for silicon-based optoelectronics. However, compound-semiconductor-based light emitters face major challenges for their integration with a silicon-based platform because of their difficulty of direct fabrication on a silicon substrate. Here, high-speed, highly-integrated graphene-based on-silicon-chip blackbody emitters in the near-infrared (NIR) region including telecommunication wavelength were developed.
  • Non-toxic filamentous virus helps quickly dissipate heat generated by electronic devices

    Scientists have discovered that the film constructed by assembling a nontoxic filamentous virus functions as a heat dissipation material, and that can be simply prepared by drying the virus aqueous solution at room temperature. This discovery is expected to elucidate the mechanism of new heat transport in electronics.

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