Down quarter for ST

ST had Q1 net revenues down 18.4% y-o-y at $3.47 billion for a gross profit down 31.6% y-o-y at $1.44 billion, a gross margin of 41.7%, an operating margin of ...
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Open Cosmos has announced its layered satellite architecture, ConnectedCosmos, for resilient Ka-band communications. The dedicated connectivity infrastructure enables a combination of norrowband and broadband services. For example, support for point-to-point ...
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NVIDIA is investing $2 billion each  in Lumentum  and  Coherent to accelerate innovation in advanced optics technologies to enable  AI infrastructure and systems designs. In both cases the deals also ...
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Ayar Labs, the co-packaged optics (CPO) specialist, has raised $500 million in Series E funding. The company will use the funds to scale high-volume production and test capacity to accelerate ...
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Avnet Silica and  Thales have joined up to deliver an eSIM offering to industry. The offering includes both a standalone eSIM component and an integrated offer combining the eSIM with ...
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Intel has appointed  Craig Barratt (pictured)  to be its next chairman, taking over from Frank Yeary who became chairman in 2023. Barratt joined the Intel board last gear. He previously ...
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Micron is sampling a 256GB LPDRAM module — 256GB SOCAMM2 – based on a  32Gb LPDDR5X die. “Micron’s 256GB SOCAMM2 offering enables the most power-efficient CPU-attached memory solution for both ...
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At MWC in Barcelona (2-5 March), Quectel Wireless Solutions launched the FGH200M long range, low power module. It is based on the IEEE 802.11ah wireless networking (Wi-Fi HaLow) protocol and ...
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RS Group has bought BPX Group, a UK and Ireland-based specialist distributor of industrial automation and control (“A&C”) products, for an Enterprise Value (cash-free debt-free) of £27 million and a ...
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ASML is looking at expanding from front-end litho into packaging, according to CTO Marco Pieters (pictured). “”We look at what are potential directions the industry could take, and what would ...
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Skyworks and Mediatek have produced a reference design of a 6G FR3 frequency range RF front-end (RFFE) power amplifier. The design of the SKYR60002 advanced 6G FR3 LNA and power ...
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Imec’s  NanoIC pilot line has brought out two PDKs for sub-2nm processes: a fine-pitch redistribution layer (RDL) and die-to-wafer (D2W) hybrid bonding PDK. These early-access PDKs bring advanced packaging capabilities ...
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Toray Industries is sampling  Toraypearl  polyamide (PA) 12, a truly spherical PA12 powder widely compatible with powder bed fusion (PBF)-type 3D printers. Leveraging Toray’s proprietary polymer particle engineering technology, the ...
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Researchers at Soitec and Nanyang Technological University have reported 60%+ power-added efficiency (PAE), for moderately scaled GaN-on-Si  HEMTs at 30GHz operation. The devices also perform with state-of-the-art noise figures down ...
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Omron’s S8AS2 compact smart power supply combines DC power supply, electronic circuit protection, and real-time monitoring in one panel-mountable unit. Reducing the number of components required in the control cabinet ...
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Rohm is licensing TSMC’s GaN process technology and installing it at its Hamamatsu fab. Rohm has been running a GaN process at Hamamatsu for four years, initially with a 150V ...
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Jedec has officially updated the Universal Flash Storage (UFS) standard with UFS 5.0. It aims to increase storage performance and efficiency for edge device AI applications. The aim is improved ...
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OpenAI has raised $110 billion from Amazon, Nvidia and Softbank. Amazon put in $50 billion and Nvidia and SoftBank put up $30 billion each. The funding round values OpenAI at ...
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Ericsson and Intel are collaborating  for the transition to AI-native 6G deployments and use cases. The collaboration will span mobile connectivity, cloud technologies, and compute capabilities across AI-driven RAN and ...
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Nvidia has hooked up with Booz Allen, BT, Cisco, Deutsche Telekom, Ericsson, MITRE, Nokia, OCUDU Ecosystem Foundation, ODC, SK Telecom, SoftBank and T-Mobile — to build 6G networks on AI-native, ...
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Semiconductor sales will grow 26% this year to $975 billion, says a report from Deloitte’s.  AI chips will be responsible for half the revenues while making up 0.2% of the ...
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Siemens Digital has brought out an Agentic Toolkit, which brings agentic AI workflows to its Questa One verification software  to accelerate creation, verification planning, execution, debugging and closure. The Toolkit ...
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Amphenol RF has added single-crimp N-Type connectors to its interconnect portfolio. These connectors offer the abilityto attach the connectors to cable with only one crimp of the ferrule, eliminating the ...
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Nordic Semiconductor has brought out a new reference design enabling secure, interoperable access control solutions for commercial and residential applications using Aliro and Matter. The release coincides with the Aliro ...
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SatVu, the London-based thermal infrared satellite specialist, has raised £30m ($40m) in its latest funding round, lead by the NATO Innovation Fund. This brings its total equity funding to £60m ...
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Rohm is using its new HPLF5060 package (4.9mm × 6.0mm) to expand its lineup of low-voltage (40V/60V) MOSFETs for automotive applications. For example, main inverter control circuits, electric pumps, and ...
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Qualcomm has announced that Kevin O’Buckley will join the company on 2 March as executive vice president of global operations and supply chain. O’Buckley is currently senior vice president and ...
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Yesterday OpenAI said London would be its largest research hub outside the US.. “We are excited to establish London as a major research hub for OpenAI, building on the leading ...
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The Tensor Robocar, a Level 4 ADAS vehicle being launched this year, is has 433 safety-capable, power-efficient Arm-based cores in each vehicle. The San Jose car company is defining its ...
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Lane Motorsport. the specialist division of Lane Electronics, has signed a UK- and Ireland-wide distribution agreement with Axon’ Cable. Axon’ have been manufacturing high performance miniature connectors and complex cable ...
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