Electronics news

Fuji Corporation has joined 3d printed electronics association JAMES (Jetted Additively Manufactured Electronics Sources), which describes itself as establishing a collaborative community that brings together professionals and enthusiasts from various fields to drive additive manufacturing development in 3D printed electronics. The addition of Fuji “will allow both companies to work together on upcoming projects, share ...
The post Fuji joins 3d printed electronics alliance appeared first

Semidynamics has announced a customisable vector unit for RISC-V processor cores, compliant with RISC-V vector specification 1.0. Vector unit are composed of several vector cores that perform multiple calculations in parallel. In this case, Semidynamics’ vector core can be tailored to support FP64, FP32, FP16, BF16, INT64, INT32, INT16 or INT8 data types depending on ...
The post RISC-V Summit: Customisable vector unit appeared first on Electronics Weekly.

Mixed-signal chip maker X-Fab Silicon Foundries is X-Fab offering a 110nm BCD-on-SoI process, claiming to be the first to do so. Called XT011, it “reflects the need for greater digital integration and processing capabilities within analogue applications”, said X-Fab, claiming: “It brings together the appealing attributes associated with both SoI and DTI [deep trench isolation], ...
The post X-Fab offers 110nm BCD-on-SoI process appeared first on Electronics Weekly.