Electronics news

For phased-array C-Band radar, CMPA5259050S and CMPA5259080S from Wolfspeed are respectively 50W and 80W 5.0-5.9GHz GaN MMIC power amplifiers. The “two-stage reactively-matched amplifier approach enables high power and power added efficiency to be achieved in a 5 x 5mm QFN surface -mount package” (black in photo), according to Richardson RFPD, which is stocking the parts, ...
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Rohm has released one and two channel 40V low-side switches with AEC-Q100 qualification for automotive and industrial use. BV1LExxxEFJ-C (single-channel, 4.9 x 6 x 1mm HTSOP-J8) and BM2LExxxFJ-C (dual-channel, 4.9 x 6 x 1.65mm SOP-J8) “are suitable for systems such as car body control, engine and transmission control units, LED lighting modules or industrial programmable ...
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TDK has introduced a range of 1,200W isolated full-brick dc-dc converter that runs from 200 to 425Vdc for high-voltage dc distributed power architectures. The PH1200A280 range is available with five output voltages: 12, 24, 28, 36 or 48V, with -40 to +20% adjustment to accommodate non-standard voltages. Efficiency  is 94% at 100% load with a 280V ...
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Toshiba has created octal high-side and low-side protected load drivers in SSOP30 packaging (9.7 x 7.6 x 1.2mm, 0.65mm pitch). The company is promoting them as smaller alternatives to SSOP24 packaged drivers like TPD2005F and TPD2007F. The new parts use the company’s latest analogue process which is BiCD – combining bipolar, CMOS and DMOS elements. ...
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Variscite has launched a SO-DIMM-sized system-on-module carrying Texas Instruments’ AM62x, which has a 1.4GHz quad-core Arm Cortex-A53, and a 400MHz Cortex-M4F, plus a 333MHz PRU real-time co-processors. Called VAR-SOM-AM62, it also offers a MIPI-CSI2 camera interface, a 3D GPU and dual LVDS display interfaces. Connectivity included dual-band Wi-Fi, Bluetooth (and LE) 5.2, 3x CAN bus, ...
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The US Department of Commerce is announceming more details regarding funding opportunities and application processes. In late February, the Department plans to release a Notice of Funding Opportunity for commercial leading-edge, current, and mature node fabrication facilities. This includes both “front-end” semiconductor manufacturers and “back-end” packaging facilities. In late spring, the Department plans to release ...
The post US DoC sets out stages for spending Chips

The Seraphim Space Accelerator – part of Seraphim, the London-based, space-focused VC – is partnering with the European Space Agency (ESA). The goal is to help the agency identify and support European-based space start-ups, providing access to the global Space Venture Capital market. This area accounted for £8bn of investment in 2022, according to Seraphim. ...
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Distrelec, the UK-Swiss distributor, has launched a brand new Robotics and Automation Guide filled with insightful information from industry experts. The first of a three-part feature, this new guide provides valuable insights to help engineers build more effective, fully-automated workflows. Chapters include a brief history of robotics, as well as robot types, applications, industry 5.0 ...
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